Mission Statement, Vision, & Core Values (2026) of JCET Group Co., Ltd.

From humble beginnings in 1972 to emerging as the largest OSAT in mainland China and the third-largest globally, JCET Group Co., Ltd. (600584.SS) has built a commanding footprint across China, Korea and Singapore as an end-to-end provider of wafer bumping, assembly, testing and global drop shipments for applications from automotive electronics to AI and high-performance computing, driving a strategic pivot to high-value services that generated a record RMB 35.96 billion in revenue in 2024 with over 72% coming from advanced packaging, underpinned by robust innovation investment of RMB 1.72 billion in R&D and strengthened by strategic moves such as the 2024 acquisition of an 80% stake in SanDisk (Shanghai), all while a mission to deliver "advanced and reliable integrated circuit back-end manufacturing technology and services for a smarter world," a vision to create lasting value for shareholders, customers, employees and society, and core values-Customer Focused, Respect and Diversity, Initiatives and Integrity, Alignment and Synergy-shape its operational and social commitments like the JCET Environmental Protection and Health Charity Fund

JCET Group Co., Ltd. (600584.SS) - Intro

• Core service offerings: semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global logistics/drop shipments.
• Application end-markets served: automotive electronics, artificial intelligence (AI), high‑performance computing (HPC), storage, communication, smart devices, industrial & medical, and power & energy.
• R&D and manufacturing footprint: cutting-edge R&D centers in China and Korea; manufacturing facilities across China, Korea and Singapore to support global supply chains.

• To provide advanced and reliable integrated circuit back‑end manufacturing technology and services for a smarter world.
• Commitment pillars: innovation in advanced packaging, consistent quality and reliability, and end‑to‑end supply chain responsiveness.

• Be the preferred global partner for advanced packaging and back‑end semiconductor solutions, enabling next‑generation AI, automotive, HPC and communications platforms.
• Drive industry leadership through higher value‑add services, expanded advanced packaging penetration, and strategic collaboration with global customers and ecosystem partners.

• Customer-centricity - align capabilities to customer roadmaps and deliver reliable, timely solutions.
• Innovation - invest in R&D to accelerate advanced packaging, heterogeneous integration and test capabilities.
• Quality & reliability - rigorous process control, qualification and testing to meet critical applications (automotive, medical, industrial).
• Operational excellence - efficient global manufacturing footprint and supply chain resiliency.
• Sustainability & responsibility - pursue energy‑efficient, compliant operations and community engagement.

• 2024 marked a strategic shift toward high‑value advanced packaging: advanced packaging contributed over 72% of RMB 35.96 billion revenue, underscoring margin and technology migration benefits.
• Geographic diversification across China, Korea and Singapore reduces single‑market exposure while enabling proximity to global IDM, fabless and foundry customers.
• R&D investments and collaborative development with global customers position JCET to capture growth in AI, automotive electrification and high‑performance compute segments.

JCET Group Co., Ltd. (600584.SS) - Overview

Mission Statement

JCET's mission is to provide advanced and reliable integrated circuit back-end manufacturing technology and services for a smarter world.

• This mission underscores the company's dedication to delivering cutting‑edge semiconductor solutions that drive technological progress across automotive, communications, consumer electronics, and industrial applications.
• The emphasis on 'advanced and reliable' highlights JCET's commitment to maintaining high standards in both technology and service quality, with continuous investments in process control, yield improvement, and testing capability.
• By focusing on 'integrated circuit back-end manufacturing,' JCET positions itself as a global leader in packaging and testing services within the semiconductor value chain.
• 'For a smarter world' reflects JCET's aim to enable intelligent devices and systems by supplying robust packaging, heterogeneous integration, and high‑density testing solutions.
• Aligned with this mission, JCET invested RMB 1.72 billion in research and development in 2024, reinforcing its roadmap for advanced packaging technologies and materials innovation.

Vision

• To be the partner of choice for global OEMs and IDM customers seeking scalable, high‑reliability back‑end semiconductor solutions that accelerate the transition to smart ecosystems.
• To lead the evolution of advanced packaging forms (3D IC, fan‑out, SiP) and testing platforms that reduce time‑to‑market and improve system performance and energy efficiency.
• To expand a resilient global delivery footprint that combines manufacturing excellence with digitalized operations and environmental stewardship.

Core Values

• Innovation - sustained investment in R&D, process development, and cross‑disciplinary engineering to stay at the forefront of packaging technology.
• Quality & Reliability - stringent manufacturing controls and testing to ensure product performance in critical applications such as automotive and telecom infrastructure.
• Customer Centricity - collaborative design‑win support and integrated supply‑chain responsiveness to meet evolving customer requirements.
• Sustainability & Safety - responsible operations that prioritize employee health, environmental compliance, and resource efficiency.
• Integrity & Teamwork - ethical governance, transparent reporting, and cross‑functional collaboration to deliver consistent results.

Strategic priorities and metrics that flow from mission and values

• R&D prioritization: funding directed to heterogeneous integration, wafer‑level fan‑out, and high‑density interconnects - evidenced by the RMB 1.72 billion R&D spend in 2024.
• Capacity & resilience: diversified global sites to support local content requirements and reduce lead‑time risk for major customers.
• Quality & compliance: certification and qualification programs tailored to automotive and telecom standards to capture higher‑value segments.
• Digital operations: rollout of smart manufacturing and data analytics to improve yield, throughput, and energy efficiency across plants.

Further context and corporate background can be explored here: JCET Group Co., Ltd.: History, Ownership, Mission, How It Works & Makes Money

JCET Group Co., Ltd. (600584.SS) - Mission Statement

• Create lasting value for shareholders through profitable growth, disciplined capital allocation, and strategic M&A (including the 2024 acquisition of an 80% stake in SanDisk (Shanghai)).
• Deliver superior solutions to customers by expanding packaging, testing, and memory-system capabilities and improving time-to-market for chipmakers.
• Invest in employees via skill development, safety, and inclusive growth to sustain a workforce capable of scaling advanced packaging and system-level integration.
• Contribute to society through responsible manufacturing, local employment, technology transfer, and environmental stewardship.

• Capacity & technology: ramp advanced packaging nodes (e.g., SiP, PoP, wafer-level packaging) and integrate memory/system capabilities acquired from SanDisk (Shanghai).
• Financial discipline: target EBITDA margin improvement through higher value-added services and scale economies from combined operations.
• Customer metrics: reduce customer product cycle time by X-Y% via integrated design-to-manufacture workflows and co-development programs (benchmarked in service-level agreements).
• Sustainability & compliance: pursue measurable reductions in energy intensity and waste, align with international ESG reporting expectations.

JCET Group Co., Ltd. (600584.SS) - Vision Statement

• Customer Focused - JCET prioritizes deep customer intimacy: tailored packaging solutions, co-development programs, and rapid time-to-market support. In 2023 JCET reported serving over 1,200 global customers across communications, computing, automotive, and industrial end-markets, with key accounts accounting for a substantial portion of revenue retention and repeat business.
• Respect and Diversity - JCET maintains a multi-regional workforce (over 40,000 employees in 2023) and has implemented inclusive hiring, training, and career development initiatives across China, Southeast Asia, and Europe. Employee engagement and retention metrics have improved year-over-year following diversity and inclusion programs.
• Initiatives and Integrity - JCET invests consistently in R&D and governance. In 2023 the company allocated more than RMB 1.2 billion to R&D, advancing heterogeneous integration, 2.5D/3D packaging, and automotive-grade qualification processes, while adhering to international compliance and anti-corruption standards.
• Alignment and Synergy - JCET focuses on cross-functional collaboration internally and alignment with supply-chain partners. Strategic M&A, capacity scaling, and co-engineering engagements have driven improved yield, faster new-product introduction, and cross-selling across regions.

• Social Responsibility: Establishment of the JCET Environmental Protection and Health Charity Fund in 2023 to support community health, environmental remediation, and STEM education programs in operating regions.
• Customer Metrics: Average customer on-time delivery performance exceeded industry benchmarks in 2023, supporting client retention and contributing to multi-year contracts with leading fabless and IDM customers.
• Governance & Ethics: Strengthened internal controls and supplier code-of-conduct audits across 100% of tier-1 suppliers during 2023 compliance reviews.

• Customer Focused → Premium service tiers, co-development programs, and capacity allocation for strategic customers to capture higher-margin advanced packaging segments.
• Respect and Diversity → Talent pipelines and cross-border teams enable multi-site collaboration and resilience in global operations.
• Initiatives and Integrity → Sustained R&D and disciplined capital investment improve technology roadmap delivery for 2.5D, fan-out, and system-in-package solutions while maintaining compliance.
• Alignment and Synergy → Vertical and horizontal partnerships (suppliers, EDA/IP partners, customers) accelerate product qualification cycles and cost efficiencies.